info@sun-tec.com.cn
010-51078138

Experimental punching machine

Experimental punching machine

Main application areas: Suitable for pilot production and research and development of MLCC, chip inductors, piezoelectric ceramics, LTCC, multi-layer RF modules, multi-layer thick film sensors, fuel cells, solar cells, etc.

Basic parameters:

model

HSP-M01

Scope of workspace

≤160mmx160mm within

Punching thickness

<2mm

hole spacing

120x120mm(±0.01mm) within

Punching size

Diameter 3.05mm ± 0.005

Equipment size

270x200x260mm (length, width, height)

working conditions

*No power required

*Compressed air: ≥ 5.5 Kgf/cm2

Explanation: The above equipment can be customized according to customer requirements.

Name
Phone
Email
Corporate name
Address
Leaving Message*
 
Verification code
Submit